Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Abstract

Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach, the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored in this paper. Results indicated that the glass transition temperatures (Tg) of DGEBA containing HGCP had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin (DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m·K, with an increase of 116.04% more than pure DGEBA (0.185524 W/m·K). Moreover, the DGEBA@HGCP@MDA composite has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast and analyze certain performances directly associated with the microstructure characteristics of the various cross-linked resin systems and their composite materials, an MD simulation approach will be quite valuable.