article · Journal of Electronic Materials

Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling

20243 citationsAin Shams University

In plain language

No abstract is available for this record, so no summary has been generated.

Research topics

Electronic Packaging and Soldering Technologies
Silicon and Solar Cell Technologies
Industrial Vision Systems and Defect Detection

Sustainable Development Goals

7Affordable and Clean Energy

Read the original research

This page summarises published work. The authoritative version sits with the publisher.

View on publisher site Record on OpenAlex

DOI: 10.1007/s11664-024-11235-1

Is something wrong with this record? Report it or request removal.

Discussion

Discuss this research

Have you built on this work, tried to replicate it, or seen it applied in practice? Share what you know. Verified researchers and MARATTO™ domain experts can open a discussion, and any member can reply. Contributions are reviewed before they appear.

No discussion yet. Open the first thread.

New to MARATTO™? Create a free account.