Monitoring Megasonic Solvent Combination with Temperature

Abstract

The combination between physical forces megasonic energy and chemicals forces with solvent provides promising results. In semiconductor industry, this combination is used to make a better removal efficiency with eliminating contamination after etching. This research aims to provide the conversion from power I to pressure field P<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">a</inf> is liquid dependent in the cleaning process, the experimental data shows that more factors than acoustic impedance should be taken into account like the distance between piezoelectric transducer and wafer object of the cleaning process, and the increase of temperature from 20°C to 50°C affect the megasonic cleaning and improves the particle removal efficiency with temperature at fixed pressure and gasification. This study seeks to ascertain whether there is a correlation between increase or decrease transient cavitation threshold and temperature of water, with realizing some analytical and numerical simulations studies which proved a decrease in transient cavitation threshold at fixed bubble radius relates when the temperature increases from 20 °C to 80 °C. Finally, we Show experimental trend lines versus simulation.