Heat Transfer Performance of a Heat Sink Using Triply Periodic Minimal Surfaces (TPMS) Structures

Abstract

Additive manufacturing processes and generative lattice structure are two increasingly popular methods in thermal management applications, particularly in the design and production of heat sinks for electronic devices. In this paper additive manufacturing was used to create heat sinks with lattice structures, specifically triple periodic minimum surfaces (TPMS). Where a conventional pin-fin heat conductor was compared with a heat sink using TPMS lattices, including Gyroid, IWP, and Neovius structures, by evaluating thermal performance. A model was physically simulated to study the thermal performance of the dispersants on the ANSYS software. The results show that the heat sink incorporating TPMS lattices exhibits superior thermal performance than the traditional pin heat sink. The research demonstrates the potential of additive manufacturing to create complex geometries that can improve the thermal dissipation of electronic devices.