Evolution of recrystallization in cold rolled and annealed copper: A texture analysis study

Abstract

This paper presents a texture analysis study of a cold rolled copper and annealed copper at 450°C for 1 min, 30 min and 100 h. Incomplete poles figures of the studied samples were collected via X-ray diffraction. The experimental data were analyzed after corrections using two methods namely Harmonic and Arbitrarily Defined Cells (ADC). The texture characteristics investigated through orientation distribution function enabled to determine the volume fraction of the prominent texture components. A comparison between results obtained by the two methods shows that the recalculated pole figures and the volume fraction of texture components obtained by the Harmonic and ADC are close. The texture evolution of the cold rolled copper during annealing show that the sharpness of the deformation texture decreased during annealing leading to a dispersed texture in fully recrystallized state (30 min of annealing). The texture after the process of grain growth (100 h annealing) was isotropic and less dispersed compared to the fully recrystallized state.