Comparison of using air, CO2 and helium for the cooling of square-shaped electronic parts: CFD study with entropy generation analysis

Abstract

Numerical simulation has been used in the current work to investigate improving the cool-down of electronic parts of cubical form involving dummy parts within a rectangular duct. Three working fluids (air, CO2, and helium) were used to cool 12 electrical chip arrays in the duct. The simulation investigates the effects of cooling fluid type and shifting hot element placements on whole cooling functioning at various Reynolds numbers. Also, the impact of the distance among electronic parts is researched. This is accomplished by moving the heat sources while leaving other components in their original positions as dummies to preserve the flow characteristics. The Reynolds number falls between (500-19000). The dimensionless entropy generation number reduces with the rise of the Reynolds number, while the pumping power ratio increases. It is determined that the dimensionless entropy generation computed for the case of constant viscosity of air yields slightly greater values than those obtained for the case of temperature-dependent viscosity. A high level of agreement in the experimental work is used to verify the standard k-model.