book chapter · Advances in chemical and materials engineering book series
Copper coatings are recognized for their outstanding corrosion resistance, wear resistance, and mechanical properties in diverse industrial applications. However conventional electrodeposition techniques often encounter challenges such as nonuniform growth and rough surface formation. This chapter reviews strategies to overcome these limitations by integrating external forces and additives into the electrodeposition process. The study explores the effects of different parameters on the coatings' microstructure, surface morphology, and microhardness. The impact of additives like leveling, grain refining, and brightening agents is examined. Additionally, electrochemical measurements evaluate the additives' effect on corrosion resistance. By optimizing deposition parameters and incorporating additives, significant improvements in copper coatings can be achieved. This review provides insights into the mechanisms of electrodeposition and offers strategies for enhancing the performance and durability of these coatings, promising wider industrial applications.
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DOI: 10.4018/979-8-3693-6341-6.ch004
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