In electronic packaging and soldering technologies
Scholar“Research focused on Electronic Packaging and Soldering Technologies and adjacent fields.”
Nigeria10
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337
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athias Ekpu is a researcher working on Electronic Packaging and Soldering Technologies. A fuller summary will appear once they update their profile.
Mathias's work has been cited 337 times across 2 active years. Bars show publications per year; the line shows cumulative citation totals across publications first appearing in each year.
Engineering Research Journal, Biodiesel Production and Applications
Engineering Research Journal, Turbomachinery Performance and Optimization
Zenodo (CERN European Organization for Nuclear Research), Multi-Criteria Decision Making
Open MIND, Multi-Criteria Decision Making
The International Journal of Advanced Manufacturing Technology, Welding Techniques and Residual Stresses
Clean Energy, Thermochemical Biomass Conversion Processes
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